Flexible Electronics News

Infineon Unveils World’s Thinnest Silicon Power Wafer

Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG has unveiled the next milestone in semiconductor manufacturing technology.   Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometers and a diameter of 300 millimeters, in a high-scale semico...

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